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Preheating Zone of Reflow Soldering Equipment.

Preheating Zone of Reflow Soldering Equipment.

The purpose of the initial heating stage is rapidly heated from room temperature at the two restrictions, first can not be too fast to make parts or PCB damaged; second can not make thinner rapid volatilization scattered. But for most paste, the diluent can not volatilize quickly, because its high boiling point make the solder paste printing process not hardened.

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