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Reflow Soldering Process

The object of reflow soldering process is surface mount board, the process is more complex, it can be divided into two types: single-sided mounting, double-sided mount.

For single-sided mount, the first, smear the solder paste, then patch, patch divided into manual placement and automatic chip placement by machine, then we start reflow used reflow soldering machine, finally, we carry out inspection and electrical testing.

For the double-sided mounting, respectively named AB side, the first, smear the solder paste on A side, then patch, we start reflow used reflow soldering machine, B side repeat the operation of A side. Finally, we carry out inspection and electrical testing.

Reflow Soldering Machine

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